TAB (Tape Automated Bonding) is a semiconductor packaging technology in which ICs are mounted on thin polymer tape with copper traces, permanently bonded to the substrate. TAB allows fine-pitch, high-density connections and is widely used in display manufacturing to connect driver ICs directly to the glass edges of LCD or OLED panels. This minimizes required space for interconnects and enables slim bezels. TAB connections are reliable, mechanically strong, and capable of handling many signal lines, but require precise manufacturing processes and specialized equipment.
TAB (Tape Automated Bonding)
TAB (tape automated bonding) mounts ICs on a thin polymer tape with copper traces, used to connect display driver chips to the edge of LCD or OLED glass.
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