Glossary

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AA (Active Area)

Active area of the matrix.

AD Board

A device for feeding video signals to a display via HDMI, DVI, VGA, or Composite interfaces.

AF Layer (Anti-Fingerprint)

Surface coating protecting displays from fingerprints and dirt.

AG Layer (Anti-Glare)

Layer diffusing reflected light, improving readability under strong external lighting.

AR Layer (Anti-Reflective)

Layer minimizing reflections, enhancing display readability.

BGA (Ball Grid Array)

Integrated circuit packaging with spherical contacts arranged in a grid, typically located at the bottom.

Bonding (Optical Bonding)

Adhesive bonding of touch panels to displays, significantly reducing reflections and enhancing image quality.

Break Out Board

Board converting FFC tape signals into pin connectors.

Bridge Board

Board connecting elements such as two FFC tapes.

Candela (Cd, Cd/m²)

Unit of luminance measured in candela per square meter.

Capacitive Touch Panel

Glass-based panel responding to capacitance changes upon touch, supporting multitouch.

Chip-on-Film (COF)

Technology mounting controllers directly onto flexible film.

Chip-on-Glass (COG)

Technology mounting controller chips directly onto display glass.

Clever System

Technology simplifying upgrades from Mono LCM to LCD-TFT displays using built-in routines.

Computer On Module (COM)

Modular computer boards facilitating quick development and easy upgrading.

Configurable Product

Standard product with individually selectable parameters.

Customization (Customized Product)

Product specifically designed to customer-defined requirements.

DFSTN (Double Film Super-Twisted Nematic)

Display matrix with enhanced contrast due to double-layer compensation film.

Digital Input/Output (DIO)

Digital input/output signals in electronic devices.

Digital Signage

Digital media for displaying advertisements or information, centrally managed.

Double Sided Adhesive Tape (DSA)

Adhesive tape with adhesive coating on both sides.

Electrostatic Discharge (ESD)

Rapid electrical impulse occurring between two differently charged objects.

Embedded MultiMedia Card (eMMC)

Integrated MMC memory and controller housed in a BGA package.

Embedded Video Engine (EVE)

Graphics solution by FTDI combining audio, video, and touch capabilities.

EMI (Electromagnetic Interference)

Device’s capability to operate correctly in an electromagnetic environment.

EMI Shielding

Reducing electromagnetic interference effects on electrical devices.

EPD (Electronic Paper Display)

Display technology mimicking paper appearance, using minimal power.

FFC (Flexible Flat Cable)

Flexible cable with flat construction, often used for internal connections.

Film Compensated Super-Twisted Nematic (FSTN)

Improved contrast STN matrix with compensation filter.

FT8xx Controller

RGB display controller by FTDI, supporting QSPI, SPI, and I²C interfaces.

GFG (Glass-Film-Glass)

Resistive touch panel structure composed of glass-film-glass layers.

Grayscale Inversion

TN display phenomenon causing color shift when viewed from certain angles.

High Tni LC

Technology eliminating overheating spots in LCD displays exposed to sunlight.

HMI (Human Machine Interfaces)

Panel computers for process control with user-friendly data presentation.

In-Plane Switching (IPS)

LCD technology offering wide viewing angles and accurate color reproduction.

IR (Infrared) Touch Panel

Touch panels using infrared sensors for detecting touch.

LCD (Liquid Crystal Display)

Display technology utilizing liquid crystals controlled by electric fields.

LED (Light-Emitting Diode)

Semiconductor diode emitting light upon electrical current passage.

Local Dimming

Zone-based backlight control improving contrast and reducing power consumption.

MaxRGB

High color saturation technology exceeding standard RGB coverage.

MMC (MultiMedia Card)

Alternative flash memory card format to SD cards.

Mounting Frame

Frame or ears for easy display installation in devices.

O-film

Filter reducing grayscale inversion effect on displays, improving viewing angles.

OLED (Organic Light Emitting Diode)

Self-illuminating organic display technology, offering true blacks and high contrast.

Package on Package (PoP)

Memory chips mounted directly atop processors.

Projected Capacitive Technology (PCT)

Advanced capacitive touchscreen technology enabling multi-touch and environmental robustness.

Rear Sided Adhesive Tape (RSA)

Double-sided adhesive tape, often synonymous with DSA.

Resistive Touch Panel

Touch sensor consisting of two conductive layers responding to physical pressure.

Sandwich

Stacked, interconnected modules.

SBC (Single Board Computer)

Compact integrated computer with high functionality and standard interfaces.

SD (Secure Digital)

Standardized memory card format.

Shield

Prototype overlay board used in electronics development.

SSD1963 Controller

TFT display controller supporting resolutions up to 864×480 pixels.

Stiffener

Reinforcement at the end of FPC tape facilitating easier and safer connections.

STN (Super-Twisted Nematic)

Passive matrix LCD technology characterized by lower cost and power consumption but slower response.

System On Module (SOM)

Complete processor modules for reducing design complexity and production costs.

TAB (Tape Automated Bonding)

Technique mounting bare chips onto PCBs via polyamide film.

Temperature Compensation

Automatic adjustment of display parameters to maintain consistent contrast across temperature variations.

TFT (Thin-Film Transistor)

Active matrix transistor technology for improved LCD display quality.

TN (Twisted Nematic)

Early, low-cost LCD technology with fast response but limited viewing angles and color stability.

uxTouch

Integrated TFT LCD displays combined with multitouch capacitive panels and customizable decorative glass.

VATN (Vertical Alignment Twisted Nematic)

LCD technology with vertically aligned crystals providing high contrast and better viewing angles, primarily for icon and alphanumeric displays.

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