Chip-on-Film (COF) is an assembly technology in which a microchip (for example, a display controller) is mounted directly on a thin flexible plastic film, usually polyimide. This allows the component size to be reduced, fewer connections to be used, and greater flexibility in the design – which is especially useful in devices with limited space or requiring bendable connections. COF enables fast signal transfer from the controller to the panel and is used in modern LCD-TFT and OLED displays and high-resolution panels where a slim design and integration are important.
The film with the chip is attached or bonded to the edge of the glass display, eliminating the need for separate PCB boards and connectors. COF technology works with interfaces like RGB, MIPI DSI or LVDS, offering high signal bandwidth and a low profile. It is found in smartphones, tablets, laptops and medical devices, among others.
