PoP (Package on Package) is a semiconductor packaging technology in which two or more chips – most commonly a processor and memory – are stacked vertically to form a compact integrated unit. The lower package usually contains the processor (application or graphics), while the upper contains RAM or Flash memory, with interconnections provided through precisely aligned contact pads.
This layered configuration saves PCB space, shortens signal paths, reduces transmission delays, and improves communication performance – critical in mobile devices like smartphones, tablets, and embedded computers. While PoP simplifies integration and increases packing density, it requires highly precise assembly and component compatibility. It is widely used in modern electronics, especially in System-on-Chip (SoC) solutions.
