BGA (Ball Grid Array) is a type of integrated circuit package where the connections are tiny solder balls arranged in a grid on the underside of the component. Unlike traditional packages with pins on the sides (e.g. DIP, QFP), a BGA allows a dense packing of connections on a small surface, making it ideal for advanced chips like microprocessors, graphics controllers or memory. BGA provides low electrical resistance, good heat dissipation and high reliability.
Because the connections are not accessible after assembly, diagnosing and servicing require specialized equipment (e.g. X-ray inspection) and reflow soldering. BGA packages are commonly used in mobile electronics, industrial computers and devices where miniaturization, thermal performance and reliability are important.
